# WF100DP 1BG D Digital Pressure Sensor — Datasheet (LLM-ready)

**Manufacturer:** Weifengheng (weifengheng.com)  
**Document:** WF100DP 1BG D Digital Pressure Sensor (WF100D_OEM.pdf → Markdown)

---

## 1. Key features

- Piezo-resistive silicon micro-machined sensor
- Gauge type pressure sensor
- **Digital interfaces:** I²C / SPI
- **Pressure ranges (options listed):** 5 / 10 / 20 / 40 / 100 / 200 / 300 / 500 / 1000 kPa  
- **Pressure sensitivity:** 0.027 Pa/LSB
- **ADC:** 24-bit Σ-Δ ADC
- **Temperature compensation:** −40 °C to 85 °C
- **Operating voltage:** 3.0 V *(also noted: 5.0 V)*
- **Operating mode current:** ~0.6 mA (typ.)
- **Sleep mode current:** 0.1 µA (typ.)
- **Packages:** SOP6 or DIP6
- RoHS compliant, halogen-free fileciteturn1file0

---

## 2. Product introduction

WF100DP series is a **gauge pressure** sensor combining:

- A silicon micro-machined sensing element
- A signal conditioning ASIC with **24-bit Σ-Δ ADC**

The ASIC outputs a highly precise digital pressure value. The datasheet states the product provides:
- ESD robustness
- Fast response time
- High accuracy and linearity
- Long-term stability

All measurement data is factory calibrated and temperature compensated, and the SOP6/DIP6 packages aim to ease system integration. fileciteturn1file0

---

## 3. Applications

- Automobile electronics
- Consumer electronics
- Household electronics
- Industrial monitoring and control
- Medical care fileciteturn1file0

---

## 4. Performance specifications (Table 1)

| Parameter | Condition | Min | Typical | Max | Unit | Remark |
|---|---:|---:|---:|---:|---|---|
| Supply Voltage | — | 1.8 | 3.0 | 5.5 | Vdc | — |
| Supply Current | — | — | 1 | — | mAdc | — |
| Pressure range | — | — | 100 *(options: 5/10/20/40/100/200/300/500/1000)* | — | kPa | — |
| Sleep current | 25 °C | — | 0.1 | 0.3 | µA | — |
| Relative accuracy | 25 °C ~ 40 °C | — | ±0.3 | — | hPa | — |
| Absolute accuracy | −40 °C ~ 125 °C | — | ±4 | — | hPa | — |
| Linearity | — | — | 0.2 | 0.5 | %FS | — |
| Resolution (ultra-high-res mode): Pressure | — | — | 0.05 | — | Pa | — |
| Resolution (ultra-high-res mode): Temperature | — | — | 0.01 | — | °C | — |
| Absolute accuracy (temperature) | 25 °C | — | ±0.5 | — | °C | — |
| Absolute accuracy (temperature) | 0 °C ~ 65 °C | — | ±1.0 | — | °C | — |
| TCR | — | 1500 | 2000 | 2500 | ppm/°C | — |
| Stability | — | — | 0.2 | — | %FS/Y | — |
| Hysteresis | — | — | 0.05 | 0.1 | %FS | — |
| Overpressure | — | — | 3X | — | — | — |
| Operation temperature | — | −40 | — | 125 | °C | — |
| I²C Clock Frequency | 3 V | — | — | 3.4 | MHz | — |
| SPI Clock Frequency | 3 V | — | 1 | 20 | MHz | — |

> “%FS” denotes percent of full scale. fileciteturn1file0

---

## 5. Application schematic (block diagram)

A block diagram (page 4) shows:
- Pressure sensor + temperature sensor feeding into a PGA
- 24-bit Σ-Δ ADC
- MCU/DSP + POR + digital register blocks
- I²C/SPI interface to external MCU
- Pins labeled: VDD, SDA/SDI, SCL/SCLK, CSB, GND fileciteturn1file0

---

## 6. Connections / pinout (SOP6 and DIP6 share the same pin definition)

### 6.1 Pin definition (Table 2)

| Pin | Name | Function |
|---:|---|---|
| 1 | GND | Connected to GND |
| 2 | SCL | Clock input for I²C/SPI |
| 3 | SDA | (1) Data in/out for I²C; (2) Data input for SPI |
| 4 | CSB | Chip select |
| 5 | VDD | Positive supply voltage |
| 6 | NC | Not connected |

The package drawing indicates a notch (“缺口”) for orientation (top view). fileciteturn1file0

---

## 7. Connection diagram (typical application)

### 7.1 I²C mode (page 5)

- A decoupling capacitor **C1 = 100 nF** is recommended from VDD to GND.
- Pull-ups on SCL and SDA are shown; a “normal value” noted is:
  - **R1 = 4.7 kΩ**, **R2 = 4.7 kΩ**
- R values should be chosen based on interface timing and bus load. fileciteturn1file0

### 7.2 SPI mode (page 5)

- CSB, SCL, SDA connect to the MCU along with VDD and GND.
- A decoupling capacitor **C1 = 100 nF** is shown on VDD. fileciteturn1file0

---

## 8. Product dimensions (mechanical)

Mechanical drawings (dimensions in mm; tolerance typically ±0.2 mm) are provided for:

- **WF100DP SOP6 Top Tube** (page 6)
- **WF100DP DIP6 Bottom Tube** (page 7)
- **WF100DP DIP6 Top Tube** (page 8)

Use the PDF drawings directly for CAD/footprint work; they contain the authoritative geometry. fileciteturn1file0

---

## 9. Order information (page 9)

The ordering code layout is shown as:

`WF100DPZ 1B G D 6 D T`

Fields described include:

- **Model:** `WF100DPZ`
- **Range code examples:**  
  - `0.05B` = 5 kPa  
  - `0.1B` = 10 kPa  
  - `0.2B` = 20 kPa  
  - `0.4B` = 40 kPa  
  - `1B` = 100 kPa  
  - `2B` = 200 kPa  
  - `3B` = 300 kPa  
  - `5B` = 500 kPa  
  - `10B` = 1000 kPa
- **Type:** `G` = gauge
- **Package:** `D` = DIP, `S` = SOP, `U` = DIP bottom tube
- **Pack:** `T` = tube, `T&R` = tape & reel
- **Digital/Analog:** `D` = digital, `A` = analog fileciteturn1file0

---

## 10. Soldering recommendation (page 10)

A Pb-free reflow profile (Figure 1 / Table 3) is provided:

| Profile feature | Pb-free |
|---|---|
| Average ramp-up rate (TsMax to TP) | 3 °C/s max |
| Preheat: Temperature Min (TsMin) | 150 °C |
| Preheat: Temperature Max (TxMax) | 200 °C |
| Preheat: Time (TsMin to TsMax) (Ts) | 60 s to 180 s |
| Time maintained above: Temperature (TL) | 217 °C |
| Time maintained above: Time (tL) | 60 s to 150 s |
| Peak temperature (TP) | 250 °C |
| Time within 5 °C of actual peak temperature (TP) | 20 s to 40 s |
| Ramp-down rate | 4 °C/s max |
| Time 25 °C to peak temperature | 8 minutes max |

> These values were read from the page-10 table/figure in the PDF. fileciteturn1file0
